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Vertical-cavity surface-emitting lasers flip-chip bonded to gigabit-per-second CMOS circuits

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13 Author(s)
Krishnamoorthy, A.V. ; Bell Labs., Lucent Technol., Holmdel, NJ, USA ; Chirovsky, L.M.F. ; Hobson, W.S. ; Leibengath, R.E.
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We describe the first integration of vertical-cavity surface-emitting laser arrays with gigabit-per-second CMOS circuits via flip-chip bonding.

Published in:

Photonics Technology Letters, IEEE  (Volume:11 ,  Issue: 1 )