By Topic

Low-power and high-quality signal transmission baseband LSIC for personal communications

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

8 Author(s)
Kobayashi, K. ; Wireless Syst. Labs., NTT Corp., Kanagawa, Japan ; Kubota, S. ; Enomoto, K. ; Seki, K.
more authors

This paper presents a very low power consumption one-chip baseband large-scale integrated circuit (LSIC) for personal communication terminals. It comprises a /spl pi//4-shift QPSK modem, an adaptive differential pulse code modulation (ADPCM) codec, a time division multiple access time division duplex (TDMA-TDD) controller and a link access procedure for a digital cordless (LAPDC: Layer-2 protocol) controller. The developed LSIC meets all the specifications of the personal handy-phone system (PHS) standard. By employing a novel coherent demodulator and an ADPCM codec with a click noise suppressor, a higher quality voice transmission has been achieved in a fading environment. In addition, it has 61-kb/s data transmission capability to achieve wireless multimedia services based on PHS. Moreover, the novel circuit configurations of the modem, the ADPCM codec, the TDMA-TDD controller, and the LAPDC controller achieve significant power reduction of the baseband circuits (57.4 mW) of personal communication terminals. It enables very low power consumption wireless multimedia terminals to be achieved based on the PHS common air interface.

Published in:

Very Large Scale Integration (VLSI) Systems, IEEE Transactions on  (Volume:6 ,  Issue: 4 )