By Topic

Integrated circuit signal measurements using an undersampling approach

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Mason, R. ; Fac. of Eng., Regina Univ., Sask., Canada ; Simon, B. ; Runtz, K.

Integrated circuit (IC) manufacturing processes have been successful in introducing complex high-speed analog and mixed-signal devices. Testing these devices is becoming increasingly difficult. The paper presents a novel method of analyzing analog IC's using periodic input stimuli and wideband undersampling. In its simplest form, the testing procedure can be implemented in a design by adding an analog switch to sample the response signal at a particular node under test and a buffer to bring the sampled values off-chip. Using a sequential undersampling algorithm to control the switch allows high-frequency signals to be mixed down in frequency and driven off-chip using a low bandwidth buffer. By placing the sampling circuit on-chip, the high-frequency buffering problems associated with a similar system using digital sampling scopes or mixed-signal IC testers can be avoided. The utility of the procedure has been illustrated by measuring the frequency response, slew rate, and transient response characteristics for a unity gain 1.2 μm CMOS opamp

Published in:

Circuits and Systems II: Analog and Digital Signal Processing, IEEE Transactions on  (Volume:45 ,  Issue: 11 )