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Full wave analysis and development of circuit models for flip chip interconnects

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4 Author(s)
D. Staiculescu ; Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA ; H. Liang ; J. Laskar ; J. Mather

This paper presents a full electromagnetic wave analysis at bump interconnects in flip chip packages. From measurement and simulation, a simple and accurate lumped element model has been developed for such flip chip interconnects. Based on our analysis, we provide basic design guidelines for flip-chip operation to 20 GHz

Published in:

Electrical Performance of Electronic Packaging, 1998. IEEE 7th Topical Meeting on

Date of Conference:

26-28 Oct 1998