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Simulation and evaluation of ground bounce induced crosstalk in a mixed logic ball grid array substrate design

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1 Author(s)
Zahn, B.A. ; ChipPAC Inc., Chandler, AZ, USA

A concurrent engineering path between package design and electrical simulation software tools was utilized to rapidly evaluate digital ground bounce and resulting crosstalk on nearby analog conductors for a mixed logic ball grid array (BGA) substrate design. Generated boundary element and lumped equivalent circuit models are discussed along with signal integrity analysis results

Published in:

Electrical Performance of Electronic Packaging, 1998. IEEE 7th Topical Meeting on

Date of Conference:

26-28 Oct 1998