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A yield improvement program using process control and process optimisation for particle reduction using in situ particle monitoring on a Semitool Magnum

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5 Author(s)
Vogels, L.J.P. ; Philips Semiconductors, Nijmegen, Netherlands ; Dohmen, M.W.C. ; van Duijvenboden, P. ; Latimer, R.A.
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Semitool, HYT/Pacific Scientific and MOS4YOU/Philips Semiconductors decided to investigate in close co-operation the process control and process optimisation through particle reduction on a Semitool Magnum wet clean system, by use of an In Situ Particle Monitor (ISPM). This is a new application for ISPM, for Semitool and for Philips. The goal of the co-operation is to evaluate the ISPM, to interpret the data generated and to improve the overall performance of the wet clean system. The ISPM detected wafers which were not cleaned properly as well as wafers which were not properly dry etched in a previous production step. Furthermore, the ISPM allowed us to improve the cleaning process, by improving the cleaning cycle of the chemical. Hereby, the ISPM proved to be a valuable tool for process control and process improvement. As particles are the main source for yield loss, the impact of a particle reduction program on yield is straightforward

Published in:

Defect and Fault Tolerance in VLSI Systems, 1998. Proceedings., 1998 IEEE International Symposium on

Date of Conference:

2-4 Nov 1998