Referenced Items are not available for this document.
The time-history deformation of plastic ball grid array (PBGA) packages during solder reflow on printed circuit boards (PCB) is measured by the electrical-resistance strain gauge method. Two groups of experiments are performed, one after 24 hours at 125°C (to bake out the moisture from the package) and the other after 24 hours at 125°C, then 85°C/85RH for 168 hours (to impose a controlled moisture content into the package). The results show that for the PBGAs with moisture content, popcorning occurs not at the peak solder-reflow temperature, but at an earlier stage
Published in:
Electronics Manufacturing Technology Symposium, 1998. Twenty-Third IEEE/CPMT
Date of Conference: 19-21 Oct 1998
- Page(s):
- 455 - 463
- Meeting Date :
- 19 Oct 1998-21 Oct 1998
- ISSN :
- 1089-8190
- Print ISBN:
- 0-7803-4523-1
- INSPEC Accession Number:
- 6214959
- Conference Location :
- Austin, TX
- Digital Object Identifier :
- 10.1109/IEMT.1998.731172
- Product Type:
- Conference Publications
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