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Real-time popcorn analysis of plastic ball grid array packages during solder reflow

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3 Author(s)
Lau, J. ; Express Packaging Syst. Inc., Palo Alto, CA, USA ; Chen, R. ; Chang, C.

The time-history deformation of plastic ball grid array (PBGA) packages during solder reflow on printed circuit boards (PCB) is measured by the electrical-resistance strain gauge method. Two groups of experiments are performed, one after 24 hours at 125°C (to bake out the moisture from the package) and the other after 24 hours at 125°C, then 85°C/85RH for 168 hours (to impose a controlled moisture content into the package). The results show that for the PBGAs with moisture content, popcorning occurs not at the peak solder-reflow temperature, but at an earlier stage

Published in:

Electronics Manufacturing Technology Symposium, 1998. Twenty-Third IEEE/CPMT

Date of Conference:

19-21 Oct 1998