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Microstrip-to-microstrip interconnects with adhesive bonded ribbons for micro- and millimeterwave applications

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3 Author(s)
Pohlmann, W. ; Fraunhofer-Inst. for Appl. Mater. Res., Bremen, Germany ; Jacob, A.F. ; Schafer, H.

A simple chip-to-chip interconnect technique with adhesive bonded ribbons is presented. It solves the insertion loss problem of wire bond interconnects in micro- and millimeterwave assemblies. The following paper discusses design and fabrication of such interconnects. A quasistatic model is developed to ease the quality assessment of their electrical behavior. It is validated by measurements on microstrip resonators with and without interconnects. The chip-to-chip interconnect technique with adhesive bonded ribbons exhibit low loss and is useable up to 50 GHz or more

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Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on  (Volume:21 ,  Issue: 4 )