Referenced Items are not available for this document.
As an easy-to-maintain low-cost packaging system, a sub-board packaging configuration has been developed. However, the simultaneous switching noise tends to increase, because a large number of switching large scale integrations (LSIs) are integrated in a sub-board. A low-cost technique for reducing simultaneous switching noise in sub-boards has been developed. A thin insulator film made of conventional FR4 substrate material is used to reduce the frequency response in the power-supply planes of the sub-board at frequencies below about 600 MHz. The Vu peak-noise amplitude was reduced by about 50% when 32 switching gates in the sub-board were simultaneously driven at 622.08 Mb/s
Published in:
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
(Volume:21
,
Issue:
4
)
Date of Publication: Nov 1998
- Page(s):
- 428 - 433
- ISSN :
- 1070-9894
- INSPEC Accession Number:
- 6105032
- Digital Object Identifier :
- 10.1109/96.730425
- Product Type:
- Journals & Magazines
- Date of Current Version :
- 06 August 2002
- Issue Date :
- Nov 1998
- Sponsored by :
- IEEE Components, Packaging, and Manufacturing Technology Society
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