Cart (Loading....) | Create Account
Close category search window
 

Numerical stress analysis of resin cracking in LSI plastic packages under temperature cyclic loading. III. Material properties and package geometries

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Saitoh, T. ; NEC Corp., Kanagawa, Japan ; Matsuyama, H. ; Toya, M.

In our previous reports [see ibid., vols. 19/20, p, 593/176, 1996/1997], geometries of the delaminations which are most likely to lead to resin cracking in large scale integration (LSI) packages subjected to temperature cyclic loading were identified for both Cu alloy and alloy 42 leadframe packages. In this paper, assuming these delaminations, we conduct comprehensive numerical stress analysis of resin cracking to study the effect of properties of encapsulant resin and die-bonding materials and the package geometry factors. The impacts of these design parameters on resin cracking are determined and a package design guide is established

Published in:

Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on  (Volume:21 ,  Issue: 4 )

Date of Publication:

Nov 1998

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.