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Polymeric conductive pastes as solder replacement for flip-chip attachment

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4 Author(s)
Maner, K.U. ; Arkansas Univ., Fayetteville, AR, USA ; Ang, S.S. ; Schaper, L.W. ; Brown, W.D.

The fabrication and characterization of flip-chip assemblies using four polymeric conductive pastes as attachment materials are reported. Three thermoset and one thermoplastic polymeric conductive pastes were investigated. Polymeric conductive pastes having silver particles 2 μm in size made good contact to either smooth or rough metal. Electrical contact with pastes whose particles were 5 μm or larger could only be obtained on rough metal

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Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on  (Volume:21 ,  Issue: 4 )