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Foreword: Microelectronics system integration

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2 Author(s)
Bolouri, Hamid ; Guest Editor University of Hertfordshire Hertfordshire, U.K. ; Laforge, Laurence E.

IT IS A delight and honor to introduce this special issue of the IEEE TRANSACTIONS ON COMPONENTS, PACKAGING, AND MANUFACTURING TECHNOLOGY — PART B: ADVANCED PACKAGING. We feature six works, each of which was presented at ISIS'97, the 1997 IEEE International Conference on Innovative Systems in Silicon. As a showcase for microelectronics systems integration, the conference spans the spectrum from submicron device technology, through design techniques, and computer aided design, to systems architecture. The papers in this issue represent a peer-reviewed consensus of conference highlights, and reflect contemporary trends in applications, miniaturization, testing, and economics. Four of the contributions exemplify how to conceive, design, and implement a silicon system. The other two focus on effective application of technology and engineering resources in evaluating silicon systems.

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Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on  (Volume:21 ,  Issue: 4 )