Cart (Loading....) | Create Account
Close category search window
 

Acoustically scanned low-coherence interrogated simultaneous measurement of absolute strain and temperature using highly birefringent fibers

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Sinha, P.G. ; Dept. of Electron. Eng., Gunma Univ., Japan ; Yoshino, T.

We have utilized a traveling acoustic pulse in a two-mode optical fiber to create a moving beam splitter coupling light from LP01 to LP11 mode. As these optical modes have different group velocities, a variable intermodal delay is generated as a function of acoustic pulse position in the fiber. The device can be used as a receiving interferometer in low-coherence interferometry to scan time delay for carrying out fast extended range absolute measurement using simple analog electronic circuits. With this scanning technique we demonstrate measurement of absolute strain over 1600 με in the temperature range from 20 to 60°C with resolutions of the order of 40 με and 0.7°C, respectively, employing highly birefringent fibers as sensing elements

Published in:

Lightwave Technology, Journal of  (Volume:16 ,  Issue: 11 )

Date of Publication:

Nov 1998

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.