By Topic

Ultrasonic transducers for high temperature applications

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $31
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
McNab, A. ; Dept. of Electron. & Electr. Eng., Strathclyde Univ., Glasgow, UK ; Kirk, K.J. ; Cochran, A.

There is an increasing demand ultrasonic transducers to work at high temperatures. Transducers operating in the range from 400 to 1000°C are being applied in the power, process, automotive and aeroengine industries, as well as in materials research. To date, the majority of high temperature transducer designs have been based on adaptations of conventional single and dual-element probes for nondestructive testing (NDT). Such designs are outlined. It is noted, however, that the attempt to construct high temperature versions of conventional transducers has led to overcomplicated, expensive structures. In particular, they are modelled on probes used for scanning at ambient temperatures, although scanning is unlikely to be possible at high temperatures. An alternative approach is therefore described, based on the monolithic ultrasonic array structure. This offers not only lower transducer costs, but also full electronic control of the ultrasonic beam angle and emission point, thus facilitating inspection of a region within a test component using only one or two devices in fixed positions. Typical results demonstrating the beam-steering performance of the array, as well as those from B-scan time-of-flight testing, are presented. It is concluded that the problems of transducer development for ultrasonic, high-temperature NDT are not yet completely solved, and that further effort is required in the key areas of materials science and transducer structure. Moreover, a simple design with the minimum of bond lines is most likely to succeed on the grounds of cost and reliability

Published in:

Science, Measurement and Technology, IEE Proceedings -  (Volume:145 ,  Issue: 5 )