By Topic

High performance no-flow underfills for low-cost flip-chip applications: material characterization

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Wong, C.P. ; Sch. of Mater. Sci. Eng., Georgia Inst. of Technol., Atlanta, GA, USA ; Shi, S.H. ; Jefferson, G.

Underfill encapsulant is critical to the reliability of the flip-chip solder joint interconnects. Novel no-flow underfill encapsulant is an attractive flip-chip encapsulant due to the simplification of the no-flow underfilling process. To develop the no-flow underfill material suitable for the no-flow underfilling process of flip-chip solder joint interconnects, we have studied and developed a series of metal chelate latent catalysts for the no-flow underfill formulation. The latent catalyst has minimal reaction with the epoxy resin (cycloaliphatic type epoxy) and the crosslinker (or hardener) at the low temperature (<180°C) prior to the solder reflow and then rapid reaction takes place to form the low-cost high performance underfills. The effects of the concentration of the hardener and catalyst on the curing profile and physical properties of the cured formulations were studied. The kinetics and exothermic heat of the curing reactions of these formulations were investigated by differential scanning calorimetry (DSC). Glass transition temperature (Tg) and thermal coefficient of expansion (TCE) of these cured resins were investigated by thermo-mechanical analyzer (TMA). Storage moduli (E',E") and crosslinking density of the cured formulations were measured by dynamic-mechanical analyzer (TMA). Weight loss of these formulations during curing was investigated by thermo-gravimetric analyzer (TGA). Additionally, some comparison results of our successful novel generic underfills with the current commercial experimental no-flow underfills are reported

Published in:

Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on  (Volume:21 ,  Issue: 3 )