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Characterization of self-heating in advanced VLSI interconnect lines based on thermal finite element simulation

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4 Author(s)
S. Rzepka ; Tech. Univ. Dresden, Germany ; K. Banerjee ; E. Meusel ; Chenming Hu

In this paper, self-heating of interconnects has been shown to affect the lifetime of next generation integrated circuits significantly more severely than today's. The paper proves the necessity for extending the system of design rules, proposes a thermal design rule, and presents an efficient and quantitatively accurate thermal simulator as tool for the design process

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IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A  (Volume:21 ,  Issue: 3 )