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Future aspects of MEMS in Germany [microelectromechanical systems]

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4 Author(s)
Topfer, M. ; Tech. Univ. Berlin, Germany ; Werner, M. ; Kaulfersch, E. ; Reichl, H.

The integration of electronic, acoustic, mechanical, thermal, optical and magnetic functions within one product is one of the great challenges for future microelectromechanical systems (MEMS) today. The development of advanced materials plays a key role for the design and development of new MEMS. Application fields and examples as well as future visions of microsystem technology are highlighted in this article. Additionally, some of the borders and requirements of today's MEMS design are also pointed out

Published in:

Industrial Electronics Society, 1998. IECON '98. Proceedings of the 24th Annual Conference of the IEEE  (Volume:4 )

Date of Conference:

31 Aug-4 Sep 1998

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