By Topic

Flexible and intelligent microcooling systems on electronic printed circuit boards

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

8 Author(s)

The rapidly rising integration density and clock frequencies of the electronic components and the constantly growing number of functions leads to an integration density and cooling problem in the components on electronic printed circuit boards. This is demonstrated here with the example of transmission techniques in telecommunications. In the solutions applied today, those of integration density are exhausted and mechanically complicated. The difficulty of introducing and applying key components quickly, inexpensively and without the limitations of functionality requires an intelligent and flexible integration method and a new cooling concept like that which is described here

Published in:

Industrial Electronics Society, 1998. IECON '98. Proceedings of the 24th Annual Conference of the IEEE  (Volume:4 )

Date of Conference:

31 Aug-4 Sep 1998