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Experimental modal analysis of PBGA printed circuit board assemblies

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6 Author(s)
Yang, Q.J. ; Nanyang Technol. Inst., Singapore ; Lim, G.H. ; Lin, R.M. ; Yap, F.F.
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In order to understand the dynamic properties and develop a valid finite element model of a plastic ball grid array (PBGA) PCB assembly, a series of experimental modal tests have been conducted and reported in this paper. Firstly, the purpose and importance of conducting these experimental modal tests are discussed. Secondly, detailed test results of our PBGA PCB assembly are presented, which can serve as a valuable reference for those who are interested in the vibration fatigue reliability of PBGA PCB assemblies. Lastly, some factors which have an important influence on the modal test results of the PCB assembly are discussed

Published in:

Electronic Packaging Technology Conference, 1997. Proceedings of the 1997 1st

Date of Conference:

8-10 Oct 1997