By Topic

Flip chip technology for multi chip modules

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Jung, E. ; Fraunhofer Inst. fur Zuverlassigkeit und Mikrointegration, Berlin, Germany ; Aschenbrenner, R. ; Busse, E. ; Reichl, H.

Miniaturization is a key issue to achieve either high performance devices or to lower overall system costs. Here, flip chip technology provides excellent capabilities to fulfil the needs of both current and future requirements. In particular, the cost and performance sensitive markets of telecommunication and automotive applications are preparing to apply flip chip technology. The paper presents two product prototypes generated in a common European project, that were assembled with this target in mind. For the telecommunication sector, a low temperature cofired ceramic (LTCC) package with additional thin film wiring was chosen to provide the required interconnection density to accommodate 6 ICs on a ceramic BGA type package. For the automotive sector, a 4 IC MCM-L BGA module was assembled to provide the highest possible level of integration to allow a reduction of overall system costs

Published in:

Electronic Packaging Technology Conference, 1997. Proceedings of the 1997 1st

Date of Conference:

8-10 Oct 1997