By Topic

Effects of interfacial residual stress on Tg of epoxy resin

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Wang, H.B. ; Dept. of Chem., Nat. Univ. of Singapore, Singapore ; Siow, K.S.

Distinct differences in the glass transition temperatures (Tg ) of epoxy resins were observed when their samples were prepared in two different ways. In the first method (A) of preparation, the mixture of epoxy resin and curing agent was cured and cooled directly in an aluminum pan for DSC measurement. There were strong interfacial residual stresses in these samples. In the second method (B), epoxy resin was cured and cooled on a polytetrafluoroethylene (PTFE) plate, cut into small circular pieces and then placed in aluminum pans, and no interfacial residual stresses were found in these samples. The curing and cooling conditions for samples prepared by these two methods were otherwise exactly the same. The samples by method A with strong residual stresses showed lower Tg and broader transition ranges (δT) than those by method B. With an increase in the rate of cooling for epoxy resin, the Tg for samples by method A decreased more than that for samples by method B. The transition range for A samples also increased more than that for B samples. The effects of residual stress on Tg are substantiated by experimental results of the relaxation of interfacial residual stress or the incorporation of freezing stress

Published in:

Electronic Packaging Technology Conference, 1997. Proceedings of the 1997 1st

Date of Conference:

8-10 Oct 1997