By Topic

The role of surface morphology on interfacial adhesion in IC packaging

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
C. Lee ; Siemens Components Pte Ltd, Singapore ; I. Rasiah ; T. C. Chai ; R. Gopalakrishnan

The role of surface morphology on moulding compound/leadframe adhesion was investigated. The surface morphology of the leadframe was modified by wet chemical treatments and abrasive blasting. In this study, the electroless Cu treatment was found to be more effective in imparting micro-level roughening than abrasive blasting. The surface roughness was found to improve interfacial adhesion and the results suggested that micro-roughness was more beneficial, rather than macro-roughness, for adhesion enhancement. The inadequacy of using RMS and Ra methods to quantify roughness was discussed. The surface area, surface area difference and power spectral density functions are proposed for more reliable and consistent roughness quantification

Published in:

Electronic Packaging Technology Conference, 1997. Proceedings of the 1997 1st

Date of Conference:

8-10 Oct 1997