Scheduled System Maintenance:
On Monday, April 27th, IEEE Xplore will undergo scheduled maintenance from 1:00 PM - 3:00 PM ET (17:00 - 19:00 UTC). No interruption in service is anticipated.
By Topic

Process characterization on chemical deflash; leading to the elimination of over-etched leads

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

1 Author(s)
Dela Cruz, R.F. ; Allegro Microsyst. Phils. Inc., Paranaque, Philippines

Out-of-control situations are usually associated with process deviation, parametric errors, operator actions, environmental factors and other variables that can affect the process or product outcome. In leadframe pretreatment processes, the deflashing acid bath is the process medium. There are several factors that can contribute to the variability of the strength of reaction of the deflashing acid which, if not properly controlled, would lead to over-etched leads. These factors were identified as acid concentration, soaking time, bath temperature and batch size. Given these factors, an experiment was conducted to delve primarily into its corollaries with etch rate as the response. The test of hypothesis is used to determine the interaction relationship of the different variables. From this study, process controls, monitors and contingency measures were developed for the elimination of over-etched leads

Published in:

Electronic Packaging Technology Conference, 1997. Proceedings of the 1997 1st

Date of Conference:

8-10 Oct 1997