Reliability assessment of a wirebond chip-on-board package subjected to accelerated thermal cycling loading

Accelerated thermal cycling reliability tests were conducted on wire-bond chip-on-board (COB) packages at Delco Electronics. Thermomechanical modeling employing nonlinear finite element analysis was conducted to simulate the thermal cycling induced stresses and strains in the wire-bond interconnection. The FEA simulation study provides deeper insights to the likely failure modes at the wire ball-wedge to silicon die region.