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Reliability assessment of a wirebond chip-on-board package subjected to accelerated thermal cycling loading

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4 Author(s)
H. L. J. Pang ; Sch. of Mech. & Production Eng., Nanyang Technol. Univ., Singapore ; T. L. Tan ; J. F. Leonard ; Y. S. Chen

Accelerated thermal cycling reliability tests were conducted on wire-bond chip-on-board (COB) packages at Delco Electronics. Thermomechanical modeling employing nonlinear finite element analysis was conducted to simulate the thermal cycling induced stresses and strains in the wire-bond interconnection. The FEA simulation study provides deeper insights to the likely failure modes at the wire ball-wedge to silicon die region

Published in:

Electronic Packaging Technology Conference, 1997. Proceedings of the 1997 1st

Date of Conference:

8-10 Oct 1997