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Effect of package construction on thermal performance of plastic IC packages

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4 Author(s)
Bhandarkar, N. ; Nat. Semicond. Manuf. Singapore Pte Ltd., Singapore ; Mhaisalkar, Subodh ; Lee, P. ; Tracy, D.

This paper explores the effect of package geometry and material on the junction-to-ambient thermal resistance (Θja) of plastic IC packages. Only internal package geometry changes are explored here for packages operating under still-air ambient conditions. Among the factors explored in this paper are drop-in heat spreaders, high thermal conductivity mold compounds and die-attach epoxies, and the effect of die-attach delamination. Forced convection and external heatsinks are not studied here, as they can form an extensive topic of study on their own

Published in:

Electronic Packaging Technology Conference, 1997. Proceedings of the 1997 1st

Date of Conference:

8-10 Oct 1997