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Thermal management of microelectronics in the 21st century

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1 Author(s)
A. Bar-Cohen ; Dept. of Mech. Eng., Minnesota Univ., Minneapolis, MN, USA

The challenges posed by high chip heat fluxes and ever more stringent performance and reliability constraints make thermal management a key enabling technology in the development of microelectronic systems for the 21st century. Thermal packaging efforts must thus be performed in the context of the salient trends and parameters that characterize the IC technology and electronic products industries. Enhanced, air-cooled heat sinks and passive immersion modules are two quite distinct thermal packaging technologies that may play a pivotal role in future electronic systems

Published in:

Electronic Packaging Technology Conference, 1997. Proceedings of the 1997 1st

Date of Conference:

8-10 Oct 1997