By Topic

Thermal management of microelectronics in the 21st century

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

1 Author(s)
Bar-Cohen, A. ; Dept. of Mech. Eng., Minnesota Univ., Minneapolis, MN, USA

The challenges posed by high chip heat fluxes and ever more stringent performance and reliability constraints make thermal management a key enabling technology in the development of microelectronic systems for the 21st century. Thermal packaging efforts must thus be performed in the context of the salient trends and parameters that characterize the IC technology and electronic products industries. Enhanced, air-cooled heat sinks and passive immersion modules are two quite distinct thermal packaging technologies that may play a pivotal role in future electronic systems

Published in:

Electronic Packaging Technology Conference, 1997. Proceedings of the 1997 1st

Date of Conference:

8-10 Oct 1997