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Low-cost, high density non volatile memory for military and space applications

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1 Author(s)
Castrucci, D.P. ; Dense-Pac Microsyst. Inc., Garden Grove, CA, USA

Summary form only given. The military and space community have begun to make the switch to solid state recording in environments ranging from wearable electronics to imaging satellites. The majority of these applications require the use of nonvolatile memory to protect data against power loss or interruptions. The limited available volume allowed for the mass of data recorded requires the bit density to be higher than that achieved with standard monolithic components. This increased density must be achieved at a cost per bit that rivals standard commercial components. Dense-pac Microsystems, Inc. has been producing high-density electronics for over 15 years. With the acceptance of plastic and of commercial components, and the increasing needs for high density, Dense-pac has introduced M-Densus, a low cost high-volume manufacturing process that produces high-density electronics for military, space and commercial applications. M-Densus technology is simple yet very flexible. When electronics are manufactured with this process, the end component offers 4-8 times the bit density, allows for upgradability on the board for the next generation, allows for different ICs on each layer (SRAM on layer 1, flash on layer 2) and enables the assembly of 3D plastic MCMs. The manufacturing process uses standard, proven materials and equipment and can be transferred to other facilities in minimal time. The process can be performed in any standard board line and the stacked component manufacturing cycle is less than 6 hours. M-Densus technology is proven, reliable and able to do fast turn production of any type of stacked component

Published in:

Nonvolatile Memory Technology Conference, 1998. 1998 Proceedings. Seventh Biennial IEEE

Date of Conference:

22-24 Jun 1998

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