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Modeling the substrate effect in interconnect line characteristics of high-speed VLSI circuits

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6 Author(s)
Jae-Kyung Wee ; Sch. of Electr. Eng., Seoul Nat. Univ., South Korea ; Chan Hyeong Park ; Hong-Shick Min ; Dae-Hyung Cho
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A new analytic model for interconnect characteristics is proposed. The model includes the frequency-dependent distribution of the current on the interconnect lines and the substrate as the current path. The validity of the proposed model has been checked by a comparison with the measurement data and the numerical simulation. Through this work, it is found that the substrate return path must be considered for the accurate prediction of the high-frequency characteristics of interconnects

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Microwave Theory and Techniques, IEEE Transactions on  (Volume:46 ,  Issue: 10 )