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Browse Journals & Magazines > Components, Packaging, and Ma ...> Volume:21 Issue:3 Help

Designed experiments to investigate the solder joint quality output of a prototype automated surface mount replacement system

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4 Author(s)
Fidan, I. ; Design & Manuf. Inst., Stevens Inst. of Technol., Hoboken, NJ, USA ; Kraft, R.P. ; Ruff, L.E. ; Derby, Stephen J.

A robotic remanufacturing system at Rensselaer has been developed to replace fine pitch surface mounted components on a populated printed circuit board (PCB). The performance goal is to maximize the quality of the solder joint output to optimize the system's throughput. The purpose of this paper is to present the process parameters determined for obtaining a good solder joint with the rework cell. Developed here and to show an analysis of the solder joint quality obtained from the developed system. Maximizing the rate of correctly reworked components by the system is not chosen as a goal for measuring the system's performance. This is because rework is a low volume process and the cell being used, is an experimental prototype system

Published in:
Components, Packaging, and Manufacturing Technology, Part C, IEEE Transactions on  (Volume:21 ,  Issue: 3 )

Date of Publication: Jul 1998

Page(s):
172 - 181
ISSN :
1083-4400
INSPEC Accession Number:
6049264
Digital Object Identifier :
10.1109/3476.720414
Product Type:
Journals & Magazines
Date of Current Version :
06 August 2002
Issue Date :
Jul 1998
Sponsored by :
IEEE Components, Packaging, and Manufacturing Technology Society

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