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Comparison of material selection methods for lead-frame package encapsulation of integrated circuits

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4 Author(s)
W. Boulos ; Gen. Org. for Ind., Egypt ; H. F. Ragaie ; S. Sakr ; N. El-Mahallawy

This paper proposes a comparative study of material selection methods as applied to lead-frame package encapsulation of integrated circuits. The chart selection method has been found to be a suitable solution to find the nearest material fulfilling the property constraints on materials

Published in:

Radio Science Conference, 1998. NRSC '98. Proceedings of the Fifteenth National

Date of Conference:

24-26 Feb 1998