Referenced Items are not available for this document.
High-performance, multifunctional systems demand novel, often revolutionary, practices in functional-block integration and packaging. Independent chip, package, and board design will have to give way to a holistic approach
Published in:
Micro, IEEE
(Volume:18
,
Issue:
4
)
Date of Publication: Jul/Aug 1998
- Page(s):
- 50 - 59
- ISSN :
- 0272-1732
- INSPEC Accession Number:
- 6005680
- Digital Object Identifier :
- 10.1109/40.710871
- Product Type:
- Journals & Magazines
- Date of Current Version :
- 06 August 2002
- Issue Date :
- Jul/Aug 1998
- Sponsored by :
- IEEE Computer Society
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