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Electrical modeling and simulation challenges in chip-package codesign

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1 Author(s)
Cangellaris, A.C. ; Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA

High-performance, multifunctional systems demand novel, often revolutionary, practices in functional-block integration and packaging. Independent chip, package, and board design will have to give way to a holistic approach

Published in:

Micro, IEEE  (Volume:18 ,  Issue: 4 )