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Microvias: the next generation of substrates and packages

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1 Author(s)
Holden, H. ; TechLead Corp., Evergreen, CO, USA

Shrinking traces and spaces combined with a rising layer count eventually enlarge density, but most fabricators merely choose to shrink via size. Vias (conductive vertical paths or holes in any substrate) were previously drilled mechanically. With the prevalence of lasers, however, the focus has turned to microvias or build-up technologies. Microvias (miniature holes smaller than 150 μm in diameter) enable connections between different layers of a PCB. But how do microvias affect substrate or integrated circuit packaging? The author believes that this innovative technology will revolutionize PCB technology-a point he demonstrates by focusing on how microvias are made and their potential impact on PCB technology. Microvias will dominate the next generation of electronic products because they provide for increased density on a smaller substrate

Published in:

Micro, IEEE  (Volume:18 ,  Issue: 4 )

Date of Publication:

Jul/Aug 1998

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