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Space charge behaviour in the insulation layer of a metal-base printed wiring board

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3 Author(s)
K. Fukunaga ; Commun. Res. Lab., Minist. of Posts & Telecommun., Tokyo, Japan ; T. Maeno ; K. Okamoto

The space charge profiles of a metal-base printed wiring board were observed. The space charge of an aged sample formed the same distribution as that of copper migration inside the insulation layer. It is found that space charge observation by means of the pulsed electroacoustic method is useful for investigating the aging phenomena of a printed wiring board

Published in:

Conduction and Breakdown in Solid Dielectrics, 1998. ICSD '98. Proceedings of the 1998 IEEE 6th International Conference on

Date of Conference:

22-25 Jun 1998