The key fabrication steps and the write/erase characteristics of a new memory metal-insulator-silicon transistor are presented. The memory cell is composed of a single silicon gate and a stacked SiOx LPCVD film as an active memory film. With this new arrangement, the memory device shows excellent endurance
Published in:
Electronics Letters
(Volume:34
,
Issue:
13
)
Date of Publication: 25 Jun 1998