Cart (Loading....) | Create Account
Close category search window

Optoelectronic characteristics of a-SiC:H-based pin thin film LEDs having a thin Mo buffer layer in contact with p-type a-Si:H

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $31
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

6 Author(s)
Yen-Ann Chen ; Dept. of Electr. Eng., Nat. Central Univ., Chung-Li, Taiwan ; Yung-Hung Wu ; Wen-Chin Tsay ; Li-Hong Laih
more authors

To improve the electroluminescence (EL) properties of the a-SiC:H-based pin thin film light-emitting diodes (TFLEDs) with the promotion of hole injection efficiency. A thin Mo metal film was used as a buffer layer to prevent reactions between the ITO (indium-tin-oxide) electrode and the p+-a-Si:H layer. With the formation of semi-transparent Mo silicide after annealing, a lower EL threshold voltage and a significantly higher brightness for a finished TFLED were achieved. The brightness of the obtained device was 1300 cd/m2 at an injection current density of 600 mA/cm2, and its EL threshold voltage was 14 V

Published in:

Electronics Letters  (Volume:34 ,  Issue: 14 )

Date of Publication:

9 Jul 1998

Need Help?

IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.