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Modeling and optimizing the costs of electronic systems

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5 Author(s)
Scheffler, M. ; Electron. Lab., Swiss Federal Inst. of Technol., Zurich, Switzerland ; Ammann, D. ; Thiel, A. ; Habiger, C.
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Today's high-density packaging technologies make early attention to most factors essential in the design of successful products. A process-oriented, scalable cost-modeling tool, the Modular Optimization Environment (MOE), enables a continuous cost-quality-performance trade-off analysis throughout the design and manufacturing process

Published in:

Design & Test of Computers, IEEE  (Volume:15 ,  Issue: 3 )

Date of Publication:

Jul-Sep 1998

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