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Analyzing packaging trade-offs during system design

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2 Author(s)
Sandborn, P.A. ; Dept. of Mech. Eng., Maryland Univ., College Park, MD, USA ; Vertal, M.

Integrating packaging trade-off analysis with functional verification and architectural design results in a complete virtual prototyping solution far optimizing complex electronic systems. The authors discuss the role of packaging costs in system design and present examples highlighting packaging design trade-offs

Published in:

Design & Test of Computers, IEEE  (Volume:15 ,  Issue: 3 )