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Glob-top reliability characterization: evaluation and analysis methods

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5 Author(s)
Doyle, R. ; Nat. Microelectron. Res. Centre, Cork, Ireland ; O'Flynn, B. ; Lawton, W. ; Barrett, J.
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Glob-top encapsulation has found widespread acceptance in electronics assembly for low-end, consumer products. To extend the use of this encapsulation method to high reliability and harsh environment conditions, a rigorous evaluation of the available materials is needed. Evaluations based on variables such as encapsulant type, chip size, substrate material and stress test were performed to compare a number of glob-top materials. Analysis techniques to determine failure modes and mechanisms are also necessary to fully understand and improve glob-top performance. This paper outlines the results of glob-top reliability trials and also includes findings on both destructive and nondestructive analysis techniques

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Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on  (Volume:21 ,  Issue: 2 )