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Impact of underfill filler particles on reliability of flip-chip interconnects

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3 Author(s)
K. Darbha ; CALCE Electron. Products & Syst. Consortium, Maryland Univ., College Park, MD, USA ; J. H. Okura ; A. Dasgupta

Parametric analytical studies are conducted to investigate whether the reliability of flip-chip solder interconnects are affected by inhomogeneities in the underfill, such as settling of the filler particles. The property gradation caused by filler settling is modeled with a micromechanics formulation. The predicted property gradients are then utilized in a finite element simulation of the flip-chip assembly, to assess the impact on solder interconnect reliability

Published in:

IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A  (Volume:21 ,  Issue: 2 )