By Topic

Automatic generation of accurate circuit models of 3-D interconnect

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
M. Kamon ; Microcosm Technol. Inc., Cambridge, MA, USA ; N. A. Marques ; L. M. Silveira ; J. White

In order to optimize high-speed systems, designers need tools that automatically generate reduced order SPICE compatible models from geometric descriptions of interconnect and packaging. In this paper, we consider structures small compared to a wavelength, and use a discretized integral formulation combined with an Arnoldi-based model-order reduction strategy to compute efficiently accurate reduced-order models from three-dimensional (3-D) structures. Several issues are addressed including: (1) formulation to insure passivity in the reduced-order models; (2) efficient reduction using preconditioned inner-loop iterative methods; (3) expansion about multiple s-domain points. Results are presented on several industrial examples to demonstrate the capabilities and speed of these new methods

Published in:

IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B  (Volume:21 ,  Issue: 3 )