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Fabrication of a parallel inter-board optical interconnection module using transferred multichip bonding

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6 Author(s)
A. Ohki ; NTT Opto-electron. Labs., Tokyo, Japan ; M. Usui ; N. Sato ; N. Matsuura
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ParaBIT (parallel inter-board optical interconnection technology) is a promising candidate for large-capacity board-to-board interconnection. In ParaBIT module assembly, a new multichip diebonding technique is needed, because precise optical device chip mounting is required for efficient optical coupling at the E/O (electric/optic conversion) and O/E (optic/electric conversion) interfaces. In this paper, we have proposed a new technique, called TMB (transferred multichip bonding), for the precise mounting of multiple optical device chips. We have also described the detailed procedures of TMB and demonstrated its use in ParaBIT module assembly

Published in:

IEMT/IMC Symposium, 2nd 1998

Date of Conference:

15-17 Apr 1998