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Vacuum-sealed silicon micromachined pressure sensors

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5 Author(s)
M. Esashi ; Tohoku Univ., Sendai, Japan ; S. Sugiyama ; K. Ikeda ; Y. Wang
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Considerable progress in silicon pressure sensors has been made in recent years. This paper discusses three types of vacuum-sealed silicon micromachined pressure sensors that represent the present state of the art in this important area. The devices are a capacitive vacuum sensor, a surface-micromachined microdiaphragm pressure sensor, and a resonant pressure sensor. Vacuum sealing for these devices is accomplished using anodic bonding, films deposited using low-pressure chemical vapor deposition, and thermal out-diffusion of hydrogen, respectively. These sensors emphasize high sensitivity, small size, and excellent stability, respectively. The silicon-diaphragm vacuum sensor uses electrostatic force balancing to achieve a wide pressure measurement range

Published in:

Proceedings of the IEEE  (Volume:86 ,  Issue: 8 )