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Pick-and-place multi-wafer bonding for optoelectronic integration

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4 Author(s)
Zhu, Z.H. ; Sch. of Electr. Eng., Cornell Univ., Ithaca, NY, USA ; Zhou, Y.C. ; Crouse, D. ; Lo, Y.H.

The pick-and-place multi-wafer bonding technology is demonstrated by simultaneous direct bonding of nine 1.3 μm InP strain-compensated multiquantum well wafers to a GaAs substrate. Both the bonded sample and the control sample showed identical X-ray diffraction characteristics and the bonded wafers had ~75% room temperature photoluminescence intensities relative to the control sample

Published in:

Electronics Letters  (Volume:34 ,  Issue: 12 )

Date of Publication:

11 Jun 1998

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