Close category search window
 

The effect of temperature dependent processes on the performance of 1.5-μm compressively strained InGaAs(P) MQW semiconductor diode lasers

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)
Sweeney, S.J. ; Dept. of Phys., Surrey Univ., Guildford, UK ; Phillips, A.F. ; Adams, A.R. ; O'Reilly, E.P.
more authors

We describe measurements of the threshold current I/sub th/ and spontaneous emission characteristics of InGaAs (P)-based 1.5-/spl mu/m compressively strained multiple-quantum-well semiconductor lasers from 90 K to above room temperature. We show that below a break-point temperature, T/sub B//spl ap/130 K, I/sub th/ and its temperature dependence are governed by the radiative current. Above this temperature, a thermally activated Auger recombination process becomes the dominant recombination mechanism responsible for both I/sub th/ and its temperature sensitivity. At room temperature nonradiative Auger recombination is found to account for approximately 80% of the threshold current in these devices.

Published in:
Photonics Technology Letters, IEEE  (Volume:10 ,  Issue: 8 )

Date of Publication: Aug. 1998

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2013 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.