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An embedded transmission line micro-ball grid array X-band power amplifier

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4 Author(s)
Budka, T. ; R&D, M/A-COM Corp., Lowell, MA, USA ; Stiborek, L. ; Heinrich, L. ; Kyhl, C.

This paper describes an electronic packaging topology using embedded transmission line (ETL) monolithic microwave integrated circuits (MMIC) that have been flip-chip mounted on a beryllia (BeO) micro-ball grid array (/spl mu/BGA) ceramic carrier with a z-axis interconnect material. Small signal S-parameters are presented at each stage during the assembly process and negligible frequency shifts are observed due to the flip-chip packaging before and after encapsulation. Increased gains of 2.0 dB with the unencapsulated and 2.2 dB with the encapsulated packaged part are observed compared to the on-wafer measurements at 10 GHz under the same bias conditions.

Published in:

Microwave Symposium Digest, 1998 IEEE MTT-S International  (Volume:3 )

Date of Conference:

7-12 June 1998