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A system architecture for use with free space optical interconnects in a 3D stacked processor environment

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8 Author(s)
Roril, J. ; Dept. of Electr. Eng., North Carolina Univ., Charlotte, NC, USA ; Marchand, P. ; Chandramani, P. ; Ekman, J.
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There exists a technology suited for dealing with the unique constraints of the 3D stacked processor environment; free space optical interconnects (FSOI). This technology uses VCSEL's, vertical cavity surface emitting lasers, as a communications medium. FSOI has been proven to work in a two dimensional matrix format that would be optimal for communications between stacks.

Published in:

Broadband Optical Networks and Technologies: An Emerging Reality/Optical MEMS/Smart Pixels/Organic Optics and Optoelectronics. 1998 IEEE/LEOS Summer Topical Meetings

Date of Conference:

20-24 July 1998