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3D stacked Si CMOS VLSI smart pixels using through-Si optoelectronic interconnections

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5 Author(s)
S. W. Bond ; Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA ; S. Jung ; O. Vendier ; M. A. Brooke
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We have presented the first demonstration of an optically interconnected three dimensional smart pixel system connecting three stacked layers of Si CMOS VLSI circuitry. We have demonstrated vertical optical communication between three CMOS circuit layers with operation speeds up to 1 Mbps. This system demonstrates the viability of implementing optical interconnections for scalable 3D interconnection systems for ultra-smart pixel applications.

Published in:

Broadband Optical Networks and Technologies: An Emerging Reality/Optical MEMS/Smart Pixels/Organic Optics and Optoelectronics. 1998 IEEE/LEOS Summer Topical Meetings

Date of Conference:

20-24 July 1998