A multilayer surface mount technology elevated by an aramid-paper and epoxy-resin composite

Experimental results are presented on an innovative SMT (surface mount technology) aramid-paper/epoxy matrix structure. An investigation of the interlayer adhesion of this composite to copper foils shows that a moderate adhesion force has been kept through the heat aging process without cupric oxide treatment on the foils. Hole piercing by a one-shot punching method and the implementation of printed polymer resistors with improved performance are demonstrated.<
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