By Topic

Cantilever beam micro-contacts in a multi-chip interconnection system

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Hong, S. ; Dept. of Mater. Sci. & Eng., Stanford Univ., CA, USA ; Weihs, T.P. ; Kwon, O.K. ; Bravman, J.C.

In order to examine the use of a compliant cantilever beam structure as a contact scheme for a multichip interconnection system (MIS), multilayer (metals and SiO2) cantilever beams were fabricated utilizing standard IC processing technologies and micromachining of silicon. The mechanical behavior and electrical characteristics of the beams were investigated to establish their optimum dimensions for use in the MIS. The number of inputs/outputs which can be achieved by this structure is ~1000 per 1-cm2 chip site. Au-to-Au contact resistance measurements, as a function of applied force, were carried out employing the Nanoindenter. The contact resistance data and the results from calculations on the maximum deflection and resisting force of these beams suggest that, through proper design, it is possible to achieve simultaneously acceptable and stable resistance values (< ~0.32 Ω) for signal transmission and reasonable flexibilities of beams. Computer simulation results show that the parasitics associated with a typical beam structure are very small (L~20 pH, C~20 fF) compared to conventional packaging technologies

Published in:

Electronic Manufacturing Technology Symposium, 1989, Proceedings. Seventh IEEE/CHMT International

Date of Conference:

25-27 Sep 1989