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Heat-pipes for electronic devices cooling and evaluation of their thermal performance

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5 Author(s)
Namba, K. ; Furukawa Electr. Co. Ltd., Japan ; Kimura, N. ; Niekawa, Y. ; Kimura, Y.
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This paper reports on the performance of miniature heat-pipes developed for the cooling of electronic equipment and on evaluation of the notebook computer cooling systems in which they are used. Experiments for the miniature heat-pipes were conducted on their thermal properties and reliability. The results indicate that the miniature heat-pipe can be applied to electronic equipment cooling, and evaluation tests of the cooling system using this miniature heat-pipe have clarified the effectiveness of the miniature heat-pipe

Published in:

Thermal and Thermomechanical Phenomena in Electronic Systems, 1998. ITHERM '98. The Sixth Intersociety Conference on

Date of Conference:

27-30 May 1998